People

Pavan Gunupudi

Associate Professor

About Pavan Gunupudi

Research

Design automation of high-speed VLSI and RF circuits; signal integrity; optical-electrical co-simulation; model-order reduction; design centring and optimization; electromagnetic compatibility.

Application

High-speed VLSI circuits; signal integrity; RF and microwave circuit analysis and simulation; silicon-photonics and microwave-photonics; yield analysis for ICs.

Activities

  • Co-author of optoelectronic simulation tool, OptiSPICE
  • Collaborative research with Optiwave Systems Inc. 
  • Member of Carleton University Committee on Quality Assurance (CUCQA)
  • Member of Departmental Graduate Attributes Committee

Recent Publications

A. Amini and P. Gunupudi, “Self-Consistent Steady-State Simulation of Microwave Photonic Systems Using Harmonic Balance,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 4, no. 3/4, pp. 472-479, March/April 2014.

Y. Cao, G. Wang, P. Gunupudi and Q. J. Zhang, “Parametric Modeling of Microwave Passive Components Using Combined Neural Networks and Transfer Functions in the Time and Frequency,” Wiley International Journal of RF and Microwave Computer-Aided Engineering, 23(1), 20-33, Jan. 2013.

T. Smy and P. Gunupudi, “Robust Simulation of Opto-electronic Systems by Alternating Complex Envelope Representations, “ IEEE Transactions on Computer Aided Design, vol. 31, no. 7, pp. 1139-1143, July 2012.

T. Smy, P. Gunupudi, S. McGarry and W. N. Ye, “Circuit Level Transient Simulation of Configurable Ring Resonators using Physical Models,”Journal of Optical Society of America B, vol. 28, no. 6, pp. 1534-1543, 2011.

P. Gunupudi, P. Tang, Q. J. Zhang and T. Smy, “Modelling Semiconductor Junctions Including Nonlinear Capacitive Effects using Neural Networks,” IEEE Workshop on Signal Propagation on Interconnects, pp. 137-138, Napoli, Italy, May 2011. 

P. Gunupudi, T. Smy, J. Klein, J. Jakubczyk, “Self-Consistent Simulation of Opto-electronic Circuits using a Modified Nodal Analysis Formulation,” IEEE Transactions on Advanced Packaging, vol. 33, no. 4, pp. 979-993, Nov. 2010.

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