Dicing and Packaging

Testing of devices fabricated for research purposes in the MFL is usually carried out by probing on wafer. A Micro Automation 1006 diamond saw, a Tempress diamond scriber, a Unitek 8-146-06 thermocompression wirebonder and a West Bond 7400 A ultrasonic wire bonder are available for the packaging of small quantities of samples.

Department of Electronics
Mackenzie Building 5170
1125 Colonel By Drive,
Ottawa, ON K1S 5B6

Tel: 613-520-5755 Fax: 613-520-5708

Email: info@doe.carleton.ca

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